超聲空化閥值和超聲波的頻率有密切關(guān)系，頻率越高，空化閥越高。超聲波清洗機(jī)換句話說，超聲波發(fā)震板頻率低，空化越容易產(chǎn)生，而且在低頻情況下液體受到壓縮和稀疏作用有更長的時間間隔，使氣泡在解體前能生長到較大的尺寸，增高空化強(qiáng)度，有利于清洗作用。

　　The cavitation threshold of ultrasound is closely related to the frequency of ultrasound, and the higher the frequency, the higher the cavitation valve. In other words, ultrasonic cleaning machines are more prone to cavitation when the frequency of the ultrasonic vibration plate is low. In addition, under low-frequency conditions, the liquid is compressed and sparsely compressed for a longer time interval, allowing bubbles to grow to a larger size before disintegration, increasing cavitation intensity and facilitating cleaning.

　　所以低頻超聲波發(fā)震板超聲清洗適用于大部件外表或者污物和清洗件外表結(jié)合度高的場所。但易腐蝕清洗件表面，不適宜清洗外表光潔度高的部件，而且空化噪音大。40KHZ左右的頻率，相同聲強(qiáng)下，發(fā)生的空化泡數(shù)量比頻率為20KHZ時多，穿透力較強(qiáng)，宜清洗外表形狀復(fù)雜或有盲孔的工件，空化噪音較小，但空化強(qiáng)度較低，適合清洗污物與被清洗件外表結(jié)合力較弱的場所。

　　So low-frequency ultrasonic vibration plate ultrasonic cleaning is suitable for places with high adhesion between the surface of large components or dirt and the surface of cleaning parts. But the surface of easily corroded cleaning parts is not suitable for cleaning components with high surface smoothness, and there is also high cavitation noise. At a frequency of around 40KHZ and the same sound intensity, there are more cavitation bubbles than at a frequency of 20KHZ, which has strong penetration power. It is recommended to clean workpieces with complex external shapes or blind holes. The cavitation noise is small, but the cavitation intensity is low, making it suitable for cleaning places where the adhesion between dirt and the surface of the cleaned part is weak.

　　高頻超聲清洗適用于計算機(jī)，微電子元件的精細(xì)清洗;兆赫超聲清洗適用于集成電路芯片、硅片及波薄膜的清洗，能去除微米、亞微米級的污物而對清洗件沒有任何損傷。因此從清洗效果及經(jīng)濟(jì)性考慮，頻率一般選擇在20—130KHZ范圍，當(dāng)然正確選擇超聲波發(fā)震板頻率至關(guān)重要，而具體合適的工作頻率的選取需要做一定的實(shí)驗(yàn)取得。

　　High frequency ultrasonic cleaning is suitable for fine cleaning of computers and microelectronic components; Megahertz ultrasonic cleaning is suitable for cleaning integrated circuit chips, silicon wafers, and wave thin films, and can remove micrometer and submicron scale dirt without any damage to the cleaned parts. Therefore, considering the cleaning effect and economy, the frequency is generally selected in the range of 20-130KHZ. Of course, the correct selection of the ultrasonic vibration plate frequency is crucial, and the specific and appropriate selection of working frequency needs to be obtained through certain experiments.

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